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Cooling System Engineering Lead

Company: Fathom Radiant
Location: Boulder
Posted on: May 3, 2021

Job Description:

Boulder, CO / Full Time / Engineering/ResearchFathom Radiant is building computer hardware to train neural networks at the human brain-scale and beyond. By combining the complementary strengths of optics and electronics, we have developed a revolutionary interconnect fabric that enables a flexible machine with the network capacity of a supercomputer and unprecedented scalability. Help us construct the future of machine intelligence. Our founding team has previously founded startups with more than $500 million in exits. We are well-funded from investors including Khosla Ventures, Jeff Bezos, and many others.We're seeking a Cooling System Engineering Lead with experience in ASIC liquid cooling approaches and advanced packaging (2.5 or 3D integration). You will lead the development of a near-chip liquid cooling system (e.g. microchannel, jet impingement or similar) including modeling and physical design, prototype and test, and transition to high volume manufacturing. You will collaborate closely with packaging, mechanical, 3D integration, IC design and optical engineers to enable novel optoelectronic hardware for machine learning.Areas of ContributionWork closely with packaging engineers to co-develop integrated cooling solutions for next generation digital and mixed-signal silicon with integrated III-V (GaAs, InP, GaN) componentsPerform fluid, thermal, and mechanical modeling to develop cooling system designs compatible with Fathom's IC packaging and optics requirementsDesign for thin film stresses, CTE mismatch, thermal and mechanical cycling, NVH and other environmental stressorsAssist with the documentation for product components including models, production drawings, inspection criteria, etc.Evaluate designs for manufacturability and reliabilityManage and collaborate with contract manufacturers for specification, fabrication and evaluation of the design and manufacturing processesOversee reliability, metrology and failure analysis of packaging componentsSome travel (RequirementsBS, MS or PhD in mechanical engineering, electrical engineering, physics, materials science or equivalent expertise requiredMinimum of 5 years of relevant experience in thermal and mechanical package design, including near-chip liquid cooling approaches such as microchannel or jet-impingementKnowledge of multi-physics simulation tools (ANSYS, SimScale, COMSOL) and 3D CAD mechanical drawing environmentFamiliarity with 2.5D and 3D microelectronics packaging processes and solutionsUnderstanding of potential manufacturing approaches such as microfabrication/MEMS, diffusion bonding, metal/ceramic bonding, etc.Experience with assembly process engineering and new product introductionExpertise in production packaging design, having previously transferred designs to manufacturingKnowledge of basic statistical process control and/or design of experiments principlesPreferred RequirementsFamiliarity with nano/microelectronics semiconductor fabrication and back end of line (BEOL) processingWorking knowledge of microelectronic packaging test equipment; experience in thermal, mechanical, electrical and environmental characterization; familiarity with failure analysis and package qualification.You'll do well here if...You enjoy thoughtful discussions fueled by problem-solving and logicYou're comfortable both leading and contributing individuallyYou're excited about the future of ML hardwareYou enjoy teaching and learning from an interdisciplinary teamSDL2017

Keywords: Fathom Radiant, Boulder , Cooling System Engineering Lead, Other , Boulder, Colorado

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