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Cooling System Engineering Lead

Company: Jobleads
Location: Boulder
Posted on: May 3, 2021

Job Description:

Boulder, CO / Full Time / Engineering/Research Fathom Radiant is building computer hardware to train neural networks at the human brain-scale and beyond. By combining the complementary strengths of optics and electronics, we have developed a revolutionary interconnect fabric that enables a flexible machine with the network capacity of a supercomputer and unprecedented scalability. Help us construct the future of machine intelligence. Our founding team has previously founded startups with more than $500 million in exits. We are well-funded from investors including Khosla Ventures, Jeff Bezos, and many others. We're seeking a Cooling System Engineering Lead with experience in ASIC liquid cooling approaches and advanced packaging (2.5 or 3D integration). You will lead the development of a near-chip liquid cooling system (e.g. microchannel, jet impingement or similar) including modeling and physical design, prototype and test, and transition to high volume manufacturing. You will collaborate closely with packaging, mechanical, 3D integration, IC design and optical engineers to enable novel optoelectronic hardware for machine learning. Areas of Contribution Work closely with packaging engineers to co-develop integrated cooling solutions for next generation digital and mixed-signal silicon with integrated III-V (GaAs, InP, GaN) components Perform fluid, thermal, and mechanical modeling to develop cooling system designs compatible with Fathom's IC packaging and optics requirements Design for thin film stresses, CTE mismatch, thermal and mechanical cycling, NVH and other environmental stressors Assist with the documentation for product components including models, production drawings, inspection criteria, etc. Evaluate designs for manufacturability and reliability Manage and collaborate with contract manufacturers for specification, fabrication and evaluation of the design and manufacturing processes Oversee reliability, metrology and failure analysis of packaging components Some travel ( Requirements BS, MS or PhD in mechanical engineering, electrical engineering, physics, materials science or equivalent expertise required Minimum of 5 years of relevant experience in thermal and mechanical package design, including near-chip liquid cooling approaches such as microchannelor jet-impingement Knowledge of multi-physics simulation tools (ANSYS, SimScale, COMSOL) and 3D CAD mechanical drawing environment Familiarity with 2.5D and 3D microelectronics packaging processes and solutions Understanding of potential manufacturing approaches such as microfabrication/MEMS, diffusion bonding, metal/ceramic bonding, etc. Experience with assembly process engineering and new product introduction Expertise in production packaging design, having previously transferred designs to manufacturing Knowledge of basic statistical process control and/or design of experiments principles Preferred Requirements Familiarity with nano/microelectronics semiconductor fabrication and back end of line (BEOL) processing Working knowledge of microelectronic packaging test equipment; experience in thermal, mechanical, electrical and environmental characterization; familiarity with failure analysis and package qualification. You'll do well here if... You enjoy thoughtful discussions fueled by problem-solving and logic You're comfortable both leading and contributing individually You're excited about the future of ML hardware You enjoy teaching and learning from an interdisciplinary team

Keywords: Jobleads, Boulder , Cooling System Engineering Lead, Other , Boulder, Colorado

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